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Four-Point Probe Sheet Resistance Calculator engineering
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Four-Point Probe Sheet Resistance Calculator

Semiconductor wafer metrology & doping characterization: Compute sheet resistance ($R_s$), bulk resistivity ($ ho$), and active carrier concentration from four-point probe ($V/I$) measurements.

Probe Electrical Readings & Geometry

Outer probe pair current
Inner probe pair potential
Conductive layer or wafer thickness
Collinear tip distance (typ. 1.0 mm)
Mobility calibration regime
Geometric correction factor F

Sheet Resistance & Resistivity

Sheet Resistance (R_s)
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-
Bulk Resistivity (ρ)
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ρ = R_s · t
Estimated Carrier Density (N)
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Doping concentration (cm⁻³)
Conductivity (σ)
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σ = 1 / ρ (S/cm)
Geometric Factor C = (π / ln 2)
4.532
Thin-film limit (t ≪ s)
Apparent Resistance (V / I)
-
Direct ohms reading

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Frequently Asked Questions

Why does four-point probe eliminate contact resistance?

In a standard 2-point probe, the measured resistance includes probe-to-semiconductor contact resistance and lead resistance. In a 4-point probe, the inner voltage sensing probes carry almost zero current due to the voltmeter giga-ohm input impedance, preventing contact resistance voltage drops.

What is the physical meaning of ohms per square (Ω/□)?

Sheet resistance is independent of the size of the square. For a square thin film of length L and width W = L, resistance R = ρ · L / (t · W) = ρ / t = Rs. Whether a square is 10 µm × 10 µm or 10 cm × 10 cm, its end-to-end resistance is always exactly Rs.

When must geometric correction factors be applied?

The standard constant 4.532 applies to infinitely large sheets where thickness t < s/2. When measuring near a wafer edge (distance < 5s) or on small test dies, current cannot spread symmetrically in 2D, requiring edge correction factors F(d/s) to prevent overestimating resistivity.