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Free MOSFET Heatsink Thermal Calculator Electronics & Embedded
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Free MOSFET Heatsink Thermal Calculator

Size heatsinks for power MOSFETs, IGBTs, and regulators (TO-220, TO-247, D2PAK). Calculate junction temperature, total thermal resistance, and heatsink extrusion area.

Power Dissipation & Thermal Limits

Watts
Conduction loss (I²×R) + switching loss.
°C
Good practice: 100-115°C (well below 150°C max).
°C
Inside enclosure: 40°C to 50°C typical.
Max Allowable Heatsink Thermal Resistance
2.97 °C/W (ΔT Budget: 70.0 °C)

✓ Achievable with standard aluminum extruded heatsink

Total Thermal Resistance 4.67 °C/W R_jc + R_cs + R_sa
Heatsink Surface Temp 84.5 °C Heatsink to ambient
Estimated Heatsink Physical Sizing

Estimated Extrusion Surface Area: ~420 cm² (65 sq in)

Typical Dimensions: Approx 75mm × 50mm × 35mm finned extrusion

Thermal Circuit Analogy: Temperature is voltage ($V = Delta T$), thermal resistance is electrical resistance ($R = R_{ heta}$), and heat flow is current ($I = P$). The junction temperature is simply $T_J = T_A + P_D imes (R_{ heta JC} + R_{ heta CS} + R_{ heta SA})$.

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The Semiconductor Thermal Circuit

Every Watt of power dissipated in a silicon die must conduct through a series of thermal resistances to reach the ambient air:

Thermal Loop: T_J = T_A + P_D × (R_θJC + R_θCS + R_θSA)
Allowable Heatsink: R_θSA = [ (T_J_max - T_A) / P_D ] - (R_θJC + R_θCS)

Where:

  • $R_{ heta JC}$ (Junction-to-Case): Internal resistance from silicon die to the copper mounting tab, fixed by package design.
  • $R_{ heta CS}$ (Case-to-Sink): Resistance across the thermal paste, mica washer, or silicone Sil-Pad.
  • $R_{ heta SA}$ (Sink-to-Ambient): Convective and radiative resistance of the finned aluminum heatsink.

Natural Convection vs. Forced Air

In natural convection, buoyant hot air rises slowly (air velocity < 50 LFM). Adding a small chassis fan (150 to 300 LFM) reduces heatsink thermal resistance by 50% to 70%, allowing a heatsink less than half the size to dissipate the same wattage.

Frequently Asked Questions

Why shouldn’t I run my MOSFET right at its 150°C or 175°C datasheet rating?

The datasheet 150°C rating is an absolute maximum stress rating. Operating silicon near 150°C drastically degrades reliability, accelerates electromigration, causes thermal runaway due to rising Rds(on), and risks solder joint fatigue. Commercial designs target Tj ≤ 100°C to 115°C.

What happens if the calculated Rth_sa is negative?

A negative Rth_sa means that the combined internal package resistance (R_jc) and interface pad (R_cs) alone are so high that the junction will overheat even with an infinitely large heatsink at 0 °C/W. You must either reduce power dissipation, step up to a larger package (TO-247), or parallel multiple MOSFETs.

Does thermal paste ever dry out?

Yes! Standard silicone-based thermal grease dries out and pumps out over 3 to 5 years of thermal cycling. For high-reliability industrial and automotive equipment, engineers use phase-change thermal materials or graphite foil pads.