PCB Thermal Via Array & Thermal Resistance Calculator
Calculate thermal resistance (°C/W), junction temperature rise, and copper barrel heat dissipation for PCB thermal via arrays per IPC-7093.
PCB & Thermal Via Geometry
mm
Standard IPC-7093: 0.30 mm (12 mil)
µm
Class 2: 20 µm | Class 3: 25 µm
mm
vias
e.g. 4x4 array = 16 vias
W
Total Array Thermal Resistance
LOW THERMAL RESISTANCE
12.03 °C / W
Single via resistance: 192.41 °C/W
PCB Substrate Temperature Drop (ΔT)
+36.1 °C
Temperature drop from top thermal pad to bottom copper plane.
Copper Cross-Section & Conduction
Single Via Cu Area:
0.0216 mm²
Total Array Cu Area (N vias):
0.346 mm²
Heat Flux Density:
8.67 W / mm² (Cu)